Micromachined Quantum Circuits

Continued progress in quantum computing in the circuit quantum electrodynamics (cQED) platform will require adapting sophisticated 3D integration and RF packaging techniques found in today's high-density classical devices. This thesis describes multilayer microwave integrated quantum circuits (MMIQCs) that combine the superb coherence of three-dimensional structures with the advantages of lithographic integrated circuit fabrication. Several design and fabrication techniques are essential to this new physical architecture, notably micromachining, superconducting wafer bonding, and out-of-plane qubit coupling. This thesis explores these techniques and culminates in the design, fabrication, and measurement of a two-cavity/one-qubit MMIQC featuring qubit coupling to a superconducting micromachined cavity resonator in silicon wafers.